Effect of multiple reflow cycles on intermetallic compound creation

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925342" target="_blank" >RIV/49777513:23220/15:43925342 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247995&newsearch=true&queryText=Effect%20of%20multiple%20reflow%20cycles%20on%20intermetallic%20compound%20creation" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247995&newsearch=true&queryText=Effect%20of%20multiple%20reflow%20cycles%20on%20intermetallic%20compound%20creation</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247995" target="_blank" >10.1109/ISSE.2015.7247995</a>

Result language
angličtina
Original language name
Effect of multiple reflow cycles on intermetallic compound creation
Original language description
This paper deals with the effect of the solder profile and multiple reflow cycles on intermetallic compound (IMC) creation. Soldered joints between PCB and 1206 size chip resistors were made from SAC 305 or SnBi solder alloy. Samples were reflowed one tosix times with one of the two different soldering profiles for each soldering alloys. The thickness and composition of IMC layers were measured and observed with a scanning electron microscope. The growing of IMC layers thickness was observed. The results are presented depending on greater value of heating factor and number of reflow cycles. The shear forces for the components were measured and the fracture interfaces were inspected.
Czech name
—
Czech description
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Project
<a href="/en/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regional Innovation Centre for Electrical Engineering (RICE)</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 2015 38th International Spring Seminar on Electronics Technology (ISSE 2015)
ISBN
978-1-4799-8860-0
ISSN
2161-2528
e-ISSN
—
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Eger, Maďarsko
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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