Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F14%3A43922117" target="_blank" >RIV/49777513:23220/14:43922117 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887582" target="_blank" >http://dx.doi.org/10.1109/ISSE.2014.6887582</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887582" target="_blank" >10.1109/ISSE.2014.6887582</a>

Result language
angličtina
Original language name
Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu
Original language description
The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.
Czech name
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Czech description
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Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
ISSE 2014 - 37th International Spring Seminar on Electronics Technology - "Advances in Electronic System Integration"
ISBN
978-1-4799-4455-2
ISSN
2161-2528
e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
Verlag Dr. Markus A. Detert
Place of publication
Templin
Event location
Drážďany
Event date
May 7, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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