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Composites with nanosilica

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925792" target="_blank" >RIV/49777513:23220/15:43925792 - isvavai.cz</a>

  • Result on the web

    <a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7295404" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7295404</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ICPADM.2015.7295404" target="_blank" >10.1109/ICPADM.2015.7295404</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Composites with nanosilica

  • Original language description

    There are only a few materials that are promising composites. For decades high-voltage electrical insulation technology used ternary insulation systems; usually based on modified epoxy resins and reconstructed mica. Adding additional components into existing systems, it is possible to influence their properties. However, the disadvantage is an inhomogeneous composite structure that emerges from the very quality of these materials. Inhomogeneous structure materil causes defects during operation that increase materil and this can limit the life of the entire device. The key to solving this problem is to reduce the dimensions of the individual components, in this case the filler. This paper deals with the study of electrical insulation properties of nanocomposited based on epoxy resin filled with hydrophobic silica. Nanocomposites were created by using a dissolution method, in which a nanofiller was applied to the melted matrix DGEBA. We made a special mould to cure the samples. To determ

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2015

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of the International Conference on the Properties and Applications of Dielectric Materials (ICPADM 2015)

  • ISBN

    978-1-4799-8903-4

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    844-847

  • Publisher name

    IEEE

  • Place of publication

    Piscataway

  • Event location

    Sydney, Austrálie

  • Event date

    Jul 19, 2015

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article