Composites with micro and nanosilica

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43926524" target="_blank" >RIV/49777513:23220/15:43926524 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Composites with micro and nanosilica

Original language description

For decades high-voltage electrical insulation technology used ternary insulation systems; usually based on modified epoxy resins and reconstructed mica. Adding additional components into existing systems, it is possible to influence their properties. However, the disadvantage is an inhomogeneous composite structure that emerges from the very quality of these materials. Inhomogeneous structure material causes defects during operation that increase material and this can limit the life of the entire device. The key to solving this problem is to reduce the dimensions of the individual components, in this case the filler. This paper deals with the study of electrical insulation properties of composites based on epoxy resin filled with hydrophobic nanosilica and microsilica.

Czech name

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Czech description

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Type

O - Miscellaneous

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2015

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů