Compact device for detecting single event effects in semiconductor components

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43926821" target="_blank" >RIV/49777513:23220/15:43926821 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Compact device for detecting single event effects in semiconductor components
Original language description
The paper describes a compact system for detecting Single Event Effects (SEE) in semiconductor components. The SEE is caused by a hit into a electronic chip with an energetic particle. The hit can cause unexpected behaviour of the system. The tested component is called Device Under Test (DUT). The structure of the system is shown and used components are described with their main tasks. Some of results of the running system are shown.
Czech name
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Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of Papers : 2015 23rd Telecommunications Forum (TELFOR 2015)
ISBN
978-1-5090-0055-5
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
639-642
Publisher name
IEEE
Place of publication
Piscataway
Event location
Bělehrad, Srbsko
Event date
Nov 24, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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