Multilayer thick printed copper structures

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F18%3A43951559" target="_blank" >RIV/49777513:23220/18:43951559 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8443683" target="_blank" >https://ieeexplore.ieee.org/document/8443683</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2018.8443683" target="_blank" >10.1109/ISSE.2018.8443683</a>

Result language
angličtina
Original language name
Multilayer thick printed copper structures
Original language description
This paper deals with multilayer Thick Printed Copper (TPC) structures on alumina substrates and the testing of their mechanical and electrical properties. Multilayer thick printed copper is a new prospective technology based on sequential printing of copper and dielectric films and their firing in an inert atmosphere. It can be used for power electronics substrate manufacturing. These substrates are used in special applications such as concentrated photovoltaics, smart power modules etc. Adhesion and electrical parameters such as capacity, dielectric constant, resistivity, breakdown voltage, dielectric strength etc. before and after thermal cycling and aging are mentioned in this paper.
Czech name
—
Czech description
—

Project
<a href="/en/project/FV20140" target="_blank" >FV20140: Advanced Material System for Smart Power Microelectronics ADMAT</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2018 41st International Spring Seminar on Electronics Technology (ISSE 2018) : /proceedings/
ISBN
978-1-5386-5731-7
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
1-4
Publisher name
IEEE
Place of publication
Piscataway
Event location
Zlatibor, Serbia
Event date
May 16, 2018
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000449866600057

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