An Overview of the Thick Film Copper Technology for Power Electronics

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973306" target="_blank" >RIV/49777513:23220/24:43973306 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10712090" target="_blank" >https://ieeexplore.ieee.org/document/10712090</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ESTC60143.2024.10712090" target="_blank" >10.1109/ESTC60143.2024.10712090</a>

Result language
angličtina
Original language name
An Overview of the Thick Film Copper Technology for Power Electronics
Original language description
This paper is focused on thick film copper technology which is used for power electronic substrate manufacturing. This technology is based on the printing of copper pastes on ceramic substrates and can be used as an alternative solution to conventional metallization techniques for the realization of power electronic substrates. Many experiments regarding the optimization and verification of electrical and mechanical parameters of single-layer and multilayer copper films on Al2O3 and AlN substrates were performed. This paper contains a description of experiments and achieved electrical and mechanical parameters of single-layer or multilayer copper structures such as adhesion, electrical and thermal conductivity, resistivity, solderability and density etc. The paper also describes the interaction between copper films and Al2O3 or AlN substrates which has an influence on the electrical parameters of the whole substrate and also includes design rules for both single and multilayer copper to help properly design the final power substrate.
Czech name
—
Czech description
—

Project
<a href="/en/project/FW10010062" target="_blank" >FW10010062: Smart High voltage Aditive MANufactured modules - SHAMAN</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
ISBN
979-8-3503-9036-0
ISSN
2687-9700
e-ISSN
2687-9727
Number of pages
7
Pages from-to
—
Publisher name
IEEE
Place of publication
Piscataway
Event location
Berlín, Germany
Event date
Sep 11, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001340802800094

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