Properties of thick printed copper films on aluminum nitride substrates

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962005" target="_blank" >RIV/49777513:23220/21:43962005 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467591" target="_blank" >https://ieeexplore.ieee.org/document/9467591</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467591" target="_blank" >10.1109/ISSE51996.2021.9467591</a>

Result language
angličtina
Original language name
Properties of thick printed copper films on aluminum nitride substrates
Original language description
This paper is focused on the properties of Thi ck Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper.
Czech name
—
Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 44th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66541-477-7
ISSN
—
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscaway
Event location
web-basec Conference, Bautzen, Germany
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853459100037

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