Adhesion improvement of thick printed copper film on alumina substrates by controlling of oxygen level in furnace

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43928887" target="_blank" >RIV/49777513:23220/16:43928887 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/7563154/" target="_blank" >http://ieeexplore.ieee.org/document/7563154/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563154" target="_blank" >10.1109/ISSE.2016.7563154</a>

Result language
angličtina
Original language name
Adhesion improvement of thick printed copper film on alumina substrates by controlling of oxygen level in furnace
Original language description
This paper deals with an adhesion measuring of samples prepared by prospective TPC (Thick Printed Copper) technology. The TPC technology is used for power electronic substrate manufacturing. Copper film is screen printed on alumina substrate and fired in nitrogen atmosphere. Oxygen level dependence on adhesion of copper film to alumina base and copper film solderability was observed in this paper.
Czech name
—
Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2016)
ISBN
978-1-5090-1389-0
ISSN
—
e-ISSN
—
Number of pages
5
Pages from-to
22-26
Publisher name
IEEE
Place of publication
Piscataway
Event location
Pilsen, Czech Republic
Event date
May 18, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000387089800005

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