Comparison of copper and silver thick film on alumina substrates properties

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43931840" target="_blank" >RIV/49777513:23220/17:43931840 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/8000882/" target="_blank" >http://ieeexplore.ieee.org/document/8000882/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000882" target="_blank" >10.1109/ISSE.2017.8000882</a>

Result language
angličtina
Original language name
Comparison of copper and silver thick film on alumina substrates properties
Original language description
This paper deals with comparison of copper (Thick Printed Copper) and silver thick films on alumina substrates properties. Thick film technology is used in many fields of electronic industry. Thick printed copper is a new prospective technology, which is used for power electronics substrate manufacturing. Comparison of adhesion, solderability and other properties of TPC technology and silver thick films are mentioned in this paper.
Czech name
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Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2017)
ISBN
978-1-5386-0582-0
ISSN
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e-ISSN
neuvedeno
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Sofia, Bulgaria
Event date
May 10, 2017
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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