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Comparison of copper and silver thick film on alumina substrates properties

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43931840" target="_blank" >RIV/49777513:23220/17:43931840 - isvavai.cz</a>

  • Result on the web

    <a href="http://ieeexplore.ieee.org/document/8000882/" target="_blank" >http://ieeexplore.ieee.org/document/8000882/</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2017.8000882" target="_blank" >10.1109/ISSE.2017.8000882</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Comparison of copper and silver thick film on alumina substrates properties

  • Original language description

    This paper deals with comparison of copper (Thick Printed Copper) and silver thick films on alumina substrates properties. Thick film technology is used in many fields of electronic industry. Thick printed copper is a new prospective technology, which is used for power electronics substrate manufacturing. Comparison of adhesion, solderability and other properties of TPC technology and silver thick films are mentioned in this paper.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    Result was created during the realization of more than one project. More information in the Projects tab.

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2017

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2017)

  • ISBN

    978-1-5386-0582-0

  • ISSN

  • e-ISSN

    neuvedeno

  • Number of pages

    5

  • Pages from-to

    1-5

  • Publisher name

    IEEE

  • Place of publication

    Piscataway

  • Event location

    Sofia, Bulgaria

  • Event date

    May 10, 2017

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article