Properties of thick printed copper films on alumina substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955597" target="_blank" >RIV/49777513:23220/19:43955597 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8810277" target="_blank" >https://ieeexplore.ieee.org/document/8810277</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810277" target="_blank" >10.1109/ISSE.2019.8810277</a>
Alternative languages
Result language
angličtina
Original language name
Properties of thick printed copper films on alumina substrates
Original language description
This paper is focused on the properties of Thick Printed Copper (TPC) films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on electrical, mechanical and thermal properties of these films. The changes of these properties depending on the thickness of TPC films are described in this paper.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Wroclaw, Poland
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000049