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Study of copper thick film metallization on aluminum nitride

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43955974" target="_blank" >RIV/49777513:23220/20:43955974 - isvavai.cz</a>

  • Result on the web

    <a href="https://www.sciencedirect.com/science/article/pii/S1359646219305639" target="_blank" >https://www.sciencedirect.com/science/article/pii/S1359646219305639</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1016/j.scriptamat.2019.09.029" target="_blank" >10.1016/j.scriptamat.2019.09.029</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Study of copper thick film metallization on aluminum nitride

  • Original language description

    This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology. The copper films were printed with a new adhesion copper paste designed for both AlN and Al2O3 substrates. Scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) analyses on cross-sections have shown that the paste adhe- sion to AlN and Al2O3 is provided by different bonding mechanisms. The influence of different adhesion mechanisms on electrical and mechanical properties as well as the morphology of copper films on AlN and Al2O3 substrates are described in this paper.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    <a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2020

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    SCRIPTA MATERIALIA

  • ISSN

    1359-6462

  • e-ISSN

  • Volume of the periodical

    176

  • Issue of the periodical within the volume

    February 2020

  • Country of publishing house

    NL - THE KINGDOM OF THE NETHERLANDS

  • Number of pages

    5

  • Pages from-to

    23-27

  • UT code for WoS article

    000496838000005

  • EID of the result in the Scopus database

    2-s2.0-85072874291