Study of copper thick film metallization on aluminum nitride
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43955974" target="_blank" >RIV/49777513:23220/20:43955974 - isvavai.cz</a>
Result on the web
<a href="https://www.sciencedirect.com/science/article/pii/S1359646219305639" target="_blank" >https://www.sciencedirect.com/science/article/pii/S1359646219305639</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.scriptamat.2019.09.029" target="_blank" >10.1016/j.scriptamat.2019.09.029</a>
Alternative languages
Result language
angličtina
Original language name
Study of copper thick film metallization on aluminum nitride
Original language description
This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology. The copper films were printed with a new adhesion copper paste designed for both AlN and Al2O3 substrates. Scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) analyses on cross-sections have shown that the paste adhe- sion to AlN and Al2O3 is provided by different bonding mechanisms. The influence of different adhesion mechanisms on electrical and mechanical properties as well as the morphology of copper films on AlN and Al2O3 substrates are described in this paper.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
SCRIPTA MATERIALIA
ISSN
1359-6462
e-ISSN
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Volume of the periodical
176
Issue of the periodical within the volume
February 2020
Country of publishing house
NL - THE KINGDOM OF THE NETHERLANDS
Number of pages
5
Pages from-to
23-27
UT code for WoS article
000496838000005
EID of the result in the Scopus database
2-s2.0-85072874291