Characterization of thick film pastes for aluminum nitride substrates

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962011" target="_blank" >RIV/49777513:23220/21:43962011 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467661" target="_blank" >https://ieeexplore.ieee.org/document/9467661</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467661" target="_blank" >10.1109/ISSE51996.2021.9467661</a>

Result language
angličtina
Original language name
Characterization of thick film pastes for aluminum nitride substrates
Original language description
This paper is focused on the characterization of conductive and dielectric thick film pastes determined for aluminum nitride (AlN) substrates. Aluminum nitride is a ceramic material with high thermal conductivity and pastes determined of AlN are based on different adhesion mechanism than standard thick film pastes for alumina (Al2O3). Structural, electrical and mechanical parameters of conductive and dielectric pastes for AlN substrates are described in this paper.
Czech name
—
Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 44th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66541-477-7
ISSN
—
e-ISSN
2161-2536
Number of pages
4
Pages from-to
1-4
Publisher name
IEEE
Place of publication
Piscaway
Event location
web-basec Conference, Bautzen, Germany
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853459100077

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