Identification of thermal model of power module using expectation-maximization algorithm

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43956142" target="_blank" >RIV/49777513:23220/19:43956142 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8927553" target="_blank" >https://ieeexplore.ieee.org/document/8927553</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/IECON.2019.8927553" target="_blank" >10.1109/IECON.2019.8927553</a>

Result language
angličtina
Original language name
Identification of thermal model of power module using expectation-maximization algorithm
Original language description
Prediction of junction temperatures in power semiconductor modules is essential to improve reliability of the device and prevent module failures due to thermal stress. Lumped parameter network is a popular approach for temperature modeling. Calibration of the thermal model is based on thermal measurements of the junction temperatures that are difficult to obtain. We aim to combine the knowledge of internal model structure and as little measurements as possible. Specifically, we use a state space thermal model with structure determined by the module layout, and propose to use the Expectation-Maximization algorithm from that can utilize data from different incomplete experiments. The identification procedure is introduced in detail in this paper and the applicability of the proposed approach is demonstrated on simulated and experimental data.
Czech name
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Czech description
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Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings : IECON 2019 : 45th Annual Conference of the IEEE Industrial Electronics Society
ISBN
978-1-72814-878-6
ISSN
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e-ISSN
2577-1647
Number of pages
7
Pages from-to
1-7
Publisher name
IEEE
Place of publication
Piscataway
Event location
Lisabon, Portugal
Event date
Oct 14, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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