All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Least squares method for indentification of IGBT thermal impedance networks using direct temperature measurements

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43960146" target="_blank" >RIV/49777513:23220/20:43960146 - isvavai.cz</a>

  • Result on the web

    <a href="https://www.mdpi.com/1996-1073/13/14/3749" target="_blank" >https://www.mdpi.com/1996-1073/13/14/3749</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.3390/en13143749" target="_blank" >10.3390/en13143749</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Least squares method for indentification of IGBT thermal impedance networks using direct temperature measurements

  • Original language description

    State-of-the-art methods for determining thermal impedance networks for IGBT (Insulated Gate Bipolar Transistor) modules usually involves the establishment of the relationship between the measured transistor or diode voltage and temperature under homogenous temperature distribution across the IGBT module. The junction temperature is recomputed from the established voltage–temperature relationship and used in determining the thermal impedance network. This method requires accurate measurement of voltage drop across the transistors and diodes under specific designed heating and cooling profiles. Validation of the junction temperature is usually done using infrared camera or sensors placed close to the transistors or diodes (in some cases and open IGBT module) so that the measured temperature is as close to the junction as possible. In this paper, we propose an alternative method for determining the IGBT thermal impedance network using the principles of least squares. This method uses measured temperatures for defined heating and cooling cycles under di erent cooling conditions to determine the thermal impedance network. The results from the proposed method are compared with those obtained using state-of-the-art methods.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    <a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2020

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Energies

  • ISSN

    1996-1073

  • e-ISSN

  • Volume of the periodical

    13

  • Issue of the periodical within the volume

    14

  • Country of publishing house

    CH - SWITZERLAND

  • Number of pages

    13

  • Pages from-to

    1-13

  • UT code for WoS article

    000557665700001

  • EID of the result in the Scopus database

    2-s2.0-85089853175