Electrical resistance of solder joints on conductive ribbons

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43958901" target="_blank" >RIV/49777513:23220/20:43958901 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9120981" target="_blank" >https://ieeexplore.ieee.org/document/9120981</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120981" target="_blank" >10.1109/ISSE49702.2020.9120981</a>

Result language
angličtina
Original language name
Electrical resistance of solder joints on conductive ribbons
Original language description
The paper deals with high humidity and high temperature ageing reliability of joints soldered / glued by non-conductive adhesive (NCA) onto the conductive ribbon. The prepared samples were accelerated aged at 85°C temperature and 85% RH for 1000 hours. The main goal of the experiment was to verify the possibility of using soldering to make a conductive connection of components onto the ribbon. The joints electrical resistance was measured before, during and after ageing. The results show that using of soldering to ensure the conductive connection of components onto the ribbons is suitable and reliable. Also the using of non-conductive adhesive for this connection can be possible, but this option should be more tested and a suitable temperature limit should be found.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020
ISBN
978-1-72816-773-2
ISSN
—
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscaway
Event location
Web-based Conference, Demenovska, Slovakia
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500033

Similar results(10)