All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Reliability of glued SMD components on smart textile

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43958900" target="_blank" >RIV/49777513:23220/20:43958900 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/document/9121133" target="_blank" >https://ieeexplore.ieee.org/document/9121133</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121133" target="_blank" >10.1109/ISSE49702.2020.9121133</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Reliability of glued SMD components on smart textile

  • Original language description

    The paper deals with temperature ageing reliability of joints glued by non-conductive adhesive (NCA) onto the conductive ribbon. The samples prepared with NCA were accelerated aged at 85°C temperature for 1000 hours. The samples were also stretched on 150% of their relaxed length during the ageing. The main aim of the experiment was to verify the possibility of NCA using to make a conductive connection of components onto the ribbon. The joints electrical resistance was measured before, during and after ageing. The results show that using this technology for standard use of ribbons is suitable and reliable.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    <a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2020

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020

  • ISBN

    978-1-72816-773-2

  • ISSN

  • e-ISSN

    2161-2536

  • Number of pages

    6

  • Pages from-to

    1-6

  • Publisher name

    IEEE

  • Place of publication

    Piscaway

  • Event location

    Web-based Conference, Demenovska, Slovakia

  • Event date

    May 14, 2020

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000610543500072