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Reliability of glued joints on flexible substrates during accelerated current ageing

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955605" target="_blank" >RIV/49777513:23220/19:43955605 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/document/8810273" target="_blank" >https://ieeexplore.ieee.org/document/8810273</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2019.8810273" target="_blank" >10.1109/ISSE.2019.8810273</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Reliability of glued joints on flexible substrates during accelerated current ageing

  • Original language description

    This paper deals with reliability of joints glued by non-conductive adhesives (NCA) on flexible substrates during electrical current ageing. Also the comparison of NCA joints ageing with ECA joints ageing is presented in this paper. Two types of adhesives were used for the experiment – non-conductive UV curable acrylic adhesive Loctite AA3926 (NCA) and electrically conductive two part epoxy adhesive MG 8331S (ECA). The purpose of the experiment was to verify the reliability of NCA joints during the electrical current accelerated ageing. The electrical resistance of UV NCA joints on flexible DuPont Pyralux substrate before, during and after electrical current load was better than resistance of ECA joints and UV NCA can be recommended.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    <a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2019

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/

  • ISBN

    978-1-7281-1874-1

  • ISSN

    2161-2528

  • e-ISSN

    2161-2536

  • Number of pages

    7

  • Pages from-to

    1-7

  • Publisher name

    IEEE

  • Place of publication

    Piscataway

  • Event location

    Wroclaw, Poland

  • Event date

    May 15, 2019

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000507501000045