Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955589" target="_blank" >RIV/49777513:23220/19:43955589 - isvavai.cz</a>

Result on the web

<a href="https://link.springer.com/article/10.1007/s10854-019-01789-w" target="_blank" >https://link.springer.com/article/10.1007/s10854-019-01789-w</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s10854-019-01789-w" target="_blank" >10.1007/s10854-019-01789-w</a>

Result language

angličtina

Original language name

Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate

Original language description

This article deals with the assembly of SMD chip components onto a flexible substrate by using non-conductive adhesives. In the experiments, two electrically conductive adhesives (ECA) and two non-conductive adhesives (NCA) were used. The verification of the properties and usability of NCAs for connecting the components to the flexible substrates as an alternative for ECA was the main goal of the experiment. The results show that NCAs can be used as an alternative for ECAs and that the properties and reliability of NCA joints are comparable or better than ECA joints. The results also show that UV-curable NCAs can be recommended for the applications of attaching the components on flexible substrates, especially for the prototypes, where the application of the UV adhesive and the connection of components by this technology is much easier and faster than with ECA.

Czech name

—

Czech description

—

Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2019

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Journal of Materials Science: Materials in Electronics

ISSN

0957-4522

e-ISSN

—

Volume of the periodical

30

Issue of the periodical within the volume

15

Country of publishing house

NL - THE KINGDOM OF THE NETHERLANDS

Number of pages

10

Pages from-to

14214-14223

UT code for WoS article

000478863500040

EID of the result in the Scopus database

2-s2.0-85068867587