Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955861" target="_blank" >RIV/49777513:23220/19:43955861 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8951828" target="_blank" >https://ieeexplore.ieee.org/document/8951828</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.23919/EMPC44848.2019.8951828" target="_blank" >10.23919/EMPC44848.2019.8951828</a>
Alternative languages
Result language
angličtina
Original language name
Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate
Original language description
The paper deals with the QFN components assembly to the PET substrate with silver conductive pattern by anisotropically conductive adhesive (ACA) or non-conductive adhesive (NCA) with UV curing. Motivation for the experiment was to investigate and compare conductive joints prepared by ACA and NCA and make comparison of their reliability during the accelerated climatic ageing. For the NCA adhesive, the electrical conductivity was achieved by mechanical contact of the QFN component pads and substrate pattern pads. Therefore, the downforce on the QFN chip during the UV curing was important just as the adhesive´s shrinkage rate. The assembly of the QFN components by non-conductive adhesive had similar or better properties in comparison with anisotropically conductive adhesive (ACA) joints and therefore non-conductive adhesives could be recommended for some special applications.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 22nd Microelectronics and Packaging Conference (EMPC 2019)
ISBN
978-0-9568086-6-0
ISSN
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e-ISSN
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Number of pages
7
Pages from-to
1-7
Publisher name
IEEE
Place of publication
Piscataway
Event location
Pisa, Italy
Event date
Sep 16, 2019
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
000532694100053