SMD components assembly on a flexible substrate by non-conductive adhesives

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F18%3A43951558" target="_blank" >RIV/49777513:23220/18:43951558 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8443655" target="_blank" >https://ieeexplore.ieee.org/document/8443655</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2018.8443655" target="_blank" >10.1109/ISSE.2018.8443655</a>

Result language
angličtina
Original language name
SMD components assembly on a flexible substrate by non-conductive adhesives
Original language description
This paper presents SMD components assembly by non-conductive adhesives. Two types of non-conductive adhesives were used for the experiment – UV curable acrylic adhesive Loctite AA3926 and two-part epoxy adhesive Loctite HY4092 GY. The purpose of the experiment was to achieve good mechanical and electrical properties of the joint between the SMD component and copper pads made on flexible DuPont Kapton foil. The electrical conductivity was achieved only by mechanical contact of the component and substrate pads. Therefore, the mechanical pressure on the component during curing was important just as the adhesive’s shrinkage rates. Also, the adhesive’s amount causes a noticeable joint property modification. The assembly of the SMD components by non-conductive adhesives was comparable with quite commonly used conductive adhesives within the electrical and shear strength mechanical properties.
Czech name
—
Czech description
—

Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2018 41st International Spring Seminar on Electronics Technology (ISSE 2018) : /proceedings/
ISBN
978-1-5386-5731-7
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscataway
Event location
Zlatibor, Serbia
Event date
May 16, 2018
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000449866600029

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