Bend testing of SMD chip resistors glued on flexible substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955607" target="_blank" >RIV/49777513:23220/19:43955607 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8810230" target="_blank" >https://ieeexplore.ieee.org/document/8810230</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810230" target="_blank" >10.1109/ISSE.2019.8810230</a>
Alternative languages
Result language
angličtina
Original language name
Bend testing of SMD chip resistors glued on flexible substrates
Original language description
The paper deals with the static bend testing of electrically conductive glued joints between SMD chip resistors and conductive pattern on flexible substrates. Two types of two-part epoxy electrically conductive adhesives (EPO-TEK E4110 and MG 8331S) were used. Two flexible substrates (kapton foil with Cu pattern and PET foil with Ag pattern) were used for the experiment. The purpose of the experiment was to achieve reliable joints after the bend testing and compare these joints prepared with different adhesives on different substrates.. The electrical resistance and the mechanical shear strength of the joints were measured before and after the test. Results show that bending of prepared samples is possible without significant changes of properties. Results also show significant influence of substrate type and used adhesive on these properties.
Czech name
—
Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscataway
Event location
Wroclaw, Poland
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000022