Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962016" target="_blank" >RIV/49777513:23220/21:43962016 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467635" target="_blank" >https://ieeexplore.ieee.org/document/9467635</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467635" target="_blank" >10.1109/ISSE51996.2021.9467635</a>

Result language
angličtina
Original language name
Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon
Original language description
This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, melted and subsequently cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the leads of the SMD component (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one step. The electrical contact resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles.
Czech name
—
Czech description
—

Project
<a href="/en/project/FW03010077" target="_blank" >FW03010077: InTechTex - Innovative Technology for Integration and Encapsulation of Electronic Components for Smart Protective Clothing Resistant to Harsh Environment</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 44th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66541-477-7
ISSN
—
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscaway
Event location
web-basec Conference, Bautzen, Germany
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853459100063

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