Contacting of SMD components on the textile substrates

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43958897" target="_blank" >RIV/49777513:23220/20:43958897 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9120911" target="_blank" >https://ieeexplore.ieee.org/document/9120911</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120911" target="_blank" >10.1109/ISSE49702.2020.9120911</a>

Result language
angličtina
Original language name
Contacting of SMD components on the textile substrates
Original language description
This paper deals with contacting of the standard electrical SMD components on the textile substrates. SMD components are contacted and also encapsulated in one single step by a thermo-compress method. SMD components are embedded and fixed in the cavities of the plastic housing made by 3D printer. This housing is subsequently melted by the standard thermo-transfer device, which is used in textile industry for pattern transfer. The electrically conductive track can be embroidered by a conductive hybrid thread directly on the textile or printed by conductive ink on the housing.
Czech name
—
Czech description
—

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020
ISBN
978-1-72816-773-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscataway
Event location
Web-based Conference, Demenovska, Slovakia
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500011

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