Higher Temperature Washing of Electrically Connected SMD Components onto the Textile Ribbons

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43965463" target="_blank" >RIV/49777513:23220/22:43965463 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9812785" target="_blank" >https://ieeexplore.ieee.org/document/9812785</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812785" target="_blank" >10.1109/ISSE54558.2022.9812785</a>

Result language
angličtina
Original language name
Higher Temperature Washing of Electrically Connected SMD Components onto the Textile Ribbons
Original language description
This article addresses the higher temperature washing reliability research of interconnection technique for mounting SMD (surface mounted device) components onto conductive stretchable textile ribbons. It can be concluded that both tested interconnection technologies (i.e. low-temperature soldering and adhesive bonding) have some pros and cons, and both technologies are usable for dedicated applications. The results for soldered samples are better and stable for both tested washing temperatures 60°C and 92°C and are suitable especially for power supply applications or heating. The adhesive bonded joints have acceptable results only for 60°C washing temperature and are suitable for sensors, illumination, data transfer applications, or components with multiple leads. The research also shows that prepared joints have higher endurance than the whole ribbon.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2022 45th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66546-589-2
ISSN
2161-2536
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscaway
Event location
Vienna, Austria
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200032

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