Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43966056" target="_blank" >RIV/49777513:23220/22:43966056 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9939515" target="_blank" >https://ieeexplore.ieee.org/document/9939515</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ESTC55720.2022.9939515" target="_blank" >10.1109/ESTC55720.2022.9939515</a>
Alternative languages
Result language
angličtina
Original language name
Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles
Original language description
This article addresses the real-life functional research of electrically conductive joints of SMD components onto the electrically conductive textile stretchable ribbons. The four different connection techniques were used in the research: soldering, electrically conductive adhesive bonding, thermocompression, and non-conductive adhesive bonding. The 20 weeks of testing, including periodical weight training and washing, were realized. It can be concluded that soldering and both adhesive bonding technique are usable. The results showed that the electrical resistance of soldered samples was stable for the whole testing time and can be recommended. The results also showed that the electrical resistance of both adhesive bonded samples was growing at the first few testing cycles and stabilized for the rest many weeks of testing. It follows that also these adhesive bonding techniques can be recommended for some applications where the higher (but stable) joints resistance is acceptable.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings
ISBN
978-1-66548-947-8
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
223-227
Publisher name
IEEE
Place of publication
Piscataway
Event location
Sibiu, Romania
Event date
Sep 13, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001108538800041