Analysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomography
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43968772" target="_blank" >RIV/49777513:23220/23:43968772 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10168450" target="_blank" >https://ieeexplore.ieee.org/document/10168450</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168450" target="_blank" >10.1109/ISSE57496.2023.10168450</a>
Alternative languages
Result language
angličtina
Original language name
Analysis of the Effect of Soldered Surface Roughness on Void Formation Using Computed Tomography
Original language description
This article presents research focused on the reliability of soldered joints. The quality of solder joints is related to the presence of voids in solder joints. Voids affect not only joint strength but also other important joint parameters. The paper presents the results of the Computed Tomography (CT) analysis of solder joints. Samples with different base materials and with different roughness of soldered surfaces were analyzed. The distribution of individual void and the total volume of voids in one joint are the results of the analysis. Histograms of void count and void size are presented too. The article also presents sphericity analysis results where it is possible to see how surface roughness affects the shape and size of the voids.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/TN02000067" target="_blank" >TN02000067: Future Electronics for Industry 4.0 and Medical 4.0</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
979-8-3503-3484-5
ISSN
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e-ISSN
2161-2536
Number of pages
5
Pages from-to
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Publisher name
IEEE
Place of publication
Piscaway
Event location
Timisoara, Romania
Event date
May 10, 2023
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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