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Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00341238" target="_blank" >RIV/68407700:21230/20:00341238 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1109/ISSE49702.2020.9120951" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9120951</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120951" target="_blank" >10.1109/ISSE49702.2020.9120951</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties

  • Original language description

    Voids inside solder joints are empty spaces which can cause reliability issues. Solder joints with voids are weaker from a mechanical point of view. Additionally, the soled joints with voids are worse from the point of thermal and electrical properties. This article deals with voids inside solder joint prepared with Sn96,5Ag3Cu0,5 solder paste with different properties from the point of flux type and size of solder alloy powder. The aim of this work is to evaluate the influence of flux and particles size on the voids formation. Preparation of solder joints was done at the same process conditions for all samples. Solder joints were analysed via X-ray with following image analyses of voids. The results show that the less aggressive flux caused slightly higher voids formation from the point of the average surface area of voids at the soldering pad. Additionally, the results show that the slightly higher voids formation appears in case of solder paste with smaller solder alloy particles.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2020

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2020 43rd International Spring Seminar on Electronics Technology (ISSE)

  • ISBN

    978-1-7281-6773-2

  • ISSN

    2161-2536

  • e-ISSN

    2161-2528

  • Number of pages

    5

  • Pages from-to

  • Publisher name

    IEEE Press

  • Place of publication

    New York

  • Event location

    Demanovska Valley

  • Event date

    May 14, 2020

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000610543500022