Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00341238" target="_blank" >RIV/68407700:21230/20:00341238 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE49702.2020.9120951" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9120951</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120951" target="_blank" >10.1109/ISSE49702.2020.9120951</a>
Alternative languages
Result language
angličtina
Original language name
Study of Voids Inside Solder Joints Based on SAC305 Solder Paste with Different Properties
Original language description
Voids inside solder joints are empty spaces which can cause reliability issues. Solder joints with voids are weaker from a mechanical point of view. Additionally, the soled joints with voids are worse from the point of thermal and electrical properties. This article deals with voids inside solder joint prepared with Sn96,5Ag3Cu0,5 solder paste with different properties from the point of flux type and size of solder alloy powder. The aim of this work is to evaluate the influence of flux and particles size on the voids formation. Preparation of solder joints was done at the same process conditions for all samples. Solder joints were analysed via X-ray with following image analyses of voids. The results show that the less aggressive flux caused slightly higher voids formation from the point of the average surface area of voids at the soldering pad. Additionally, the results show that the slightly higher voids formation appears in case of solder paste with smaller solder alloy particles.
Czech name
—
Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-6773-2
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
5
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Demanovska Valley
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500022