Relationship of soldering profile, voids, formation and strength of soldered joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955621" target="_blank" >RIV/49777513:23220/19:43955621 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8810303" target="_blank" >https://ieeexplore.ieee.org/document/8810303</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810303" target="_blank" >10.1109/ISSE.2019.8810303</a>

Result language
angličtina
Original language name
Relationship of soldering profile, voids, formation and strength of soldered joints
Original language description
This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion Ag, immersion Sn) were used. Chip resistors 1206 were soldered by different soldering profile. The soldered joints were observed by X-ray and the void areas were calculated. The mechanical strength of the joints was measured after that. From the results, it is possible to find out the influence of surface finishes, soldering profiles or solder alloys on the formation of voids (area) and on the mechanical strength of joints.
Czech name
—
Czech description
—

Project
<a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscataway
Event location
Wroclaw, Poland
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000075

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