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Ultrasonic soldering, mechanical properties of solder joints

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00315617" target="_blank" >RIV/68407700:21230/17:00315617 - isvavai.cz</a>

  • Result on the web

    <a href="http://ieeexplore.ieee.org/document/8000925/" target="_blank" >http://ieeexplore.ieee.org/document/8000925/</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2017.8000925" target="_blank" >10.1109/ISSE.2017.8000925</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Ultrasonic soldering, mechanical properties of solder joints

  • Original language description

    Mechanical properties of solder joints have influence on reliability of electronic products. Therefore the knowledge of the mechanical behavior of solder joints is very important. This article deals with comparison of mechanical properties of solder joints prepared with conventional soldering methods and ultrasonic soldering methods. Material for samples preparation was based on two PCB (material FR4) with soldering pads which were soldered together. As solder alloy was used Sn965Ag3Cu0.5 for convention soldering method and active soldering alloy for ultrasound soldering. The mechanical resistance, changes according to used surface finishes the highest share strength, have been achieved for solder joints which ware prepared by ultrasonic soldering on pads with copper surface finish, worst results were achieved for pads with ENIG and HASL surface finishes.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2017

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    40th International Spring Seminar on Electronics Technology (ISSE)

  • ISBN

    978-1-5386-0582-0

  • ISSN

    2161-2536

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

  • Publisher name

    IEEE

  • Place of publication

    New York

  • Event location

    Sofia

  • Event date

    May 10, 2017

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000426973000048