Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00351163" target="_blank" >RIV/68407700:21230/21:00351163 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467552" target="_blank" >https://ieeexplore.ieee.org/document/9467552</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467552" target="_blank" >10.1109/ISSE51996.2021.9467552</a>

Result language
angličtina
Original language name
Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish
Original language description
Abstract: The study attends to the evaluation of solder joints from a mechanical point of view. Two lead-free alloys Sn99.7Cu0.3 and Sn96.5Ag3Cu0.5 (SAC305) were selected for samples preparation. To compare the results of current alloys with the most utilized solder in the past, the study comprises eutectic lead solder paste Sn63Pb37, too. Solder joints intended for observation were created by assembling chip resistors. Assembled boards were reflowed employing a hot air convection oven. Mechanical properties were evaluated by performing shear tests and microhardness measurements. Microhardness of bulk solder and intermetallic compounds (IMC) was measured using the micro-indentation Vickers test. For this purpose, a metallographic cross-section of some samples was accomplished. Solder pads on testing boards were coated by Organic Solder Preservative (OSP) and Hot Air Solder Levelling (HASL). Depending on solder paste type, the results show more or less impact of surface finish on the solder hardness. Some difference in microhardness of IMC layers and shear strength was also detected but, in these tests, results are not in favour of one surface treatment.
Czech name
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Czech description
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Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
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e-ISSN
2161-2528
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE Press
Place of publication
New York
Event location
Bautzen
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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