Comparison of mechanical resistance of SnCu and SnBi of solder joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00315797" target="_blank" >RIV/68407700:21230/17:00315797 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/8000924/" target="_blank" >http://ieeexplore.ieee.org/document/8000924/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000924" target="_blank" >10.1109/ISSE.2017.8000924</a>

Result language
angličtina
Original language name
Comparison of mechanical resistance of SnCu and SnBi of solder joints
Original language description
Mechanical stress act on solder joints during transport, function and storage of the electronic equipment. Therefore, the knowledge of solder joints resistance against it is very useful. This article deals with comparison of mechanical resistance of SnCu0,7 and Sn42Bi58 solder alloys. The experiments were based on two PCBs (smaller and larger one, with soldering pads designed according to commonly used chip package) which were soldered together. Surface finishes of soldering pads were OSP, ENIG and HASL. Mechanical test were based on sharp tip, which were driving between two PCBs. From overall point of view a slightly better results were achieved for Sn42Bi58 solder alloy. Additionally the thicknesses of intermetallic layers were compared and voids frequency inside solder joints were inspected.
Czech name
—
Czech description
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Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
40th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-5386-0582-0
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
—
Publisher name
IEEE
Place of publication
New York
Event location
Sofia
Event date
May 10, 2017
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000426973000047

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