Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43968779" target="_blank" >RIV/49777513:23220/23:43968779 - isvavai.cz</a>
Result on the web
<a href="http://hdl.handle.net/11025/53040" target="_blank" >http://hdl.handle.net/11025/53040</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.3390/polym15112526" target="_blank" >10.3390/polym15112526</a>
Alternative languages
Result language
angličtina
Original language name
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials
Original language description
Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications. The realized specimens are characterized by low resistance (median 21 mW), linear voltage–current characteristics, and fluid-resistant encapsulation. The contact area is comprehensively analyzed and compared withthe theoretical Holm’s model.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/TN02000067" target="_blank" >TN02000067: Future Electronics for Industry 4.0 and Medical 4.0</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Polymers
ISSN
2073-4360
e-ISSN
2073-4360
Volume of the periodical
15
Issue of the periodical within the volume
11
Country of publishing house
CH - SWITZERLAND
Number of pages
21
Pages from-to
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UT code for WoS article
001006301400001
EID of the result in the Scopus database
2-s2.0-85161539050