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Technology for direct assembly of SMD components in stretchable textile electronics realized by printing

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F25%3A43975245" target="_blank" >RIV/49777513:23220/25:43975245 - isvavai.cz</a>

  • Result on the web

    <a href="https://iopscience.iop.org/article/10.1088/2058-8585/adba74" target="_blank" >https://iopscience.iop.org/article/10.1088/2058-8585/adba74</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1088/2058-8585/adba74" target="_blank" >10.1088/2058-8585/adba74</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Technology for direct assembly of SMD components in stretchable textile electronics realized by printing

  • Original language description

    In this article, a novelty direct assembly method for stretchable e-textile electronics based on printed technologies is presented. Presented technology utilizes the assembly of components directly into the wet base layout paste, without any interfacing contact material (such as conductive adhesive). Such assembly reduces the number of technological steps and exhibits more reliable behavior, as the number of interfaces is reduced and the conductive material is highly stretchable. Components are encapsulated using flexible encapsulation and the whole electrical system is realized on a foil, which is then thermo-transferred to the textile substrate. Samples are subjected to the bend test and cyclic stretch tests. Direct assembly is proven to be robust enough, as its increase of resistance during cyclic stretch testing is much lower (17% after 500 cycles) than assembly with isotopically conductive adhesive. Direct assembly also exhibits rapid regeneration of resistance after the end of mechanical load. In addition, a low and sufficient contact resistance of around 100 mΩ is achieved.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2025

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Flexible and Printed Electronics

  • ISSN

    2058-8585

  • e-ISSN

    2058-8585

  • Volume of the periodical

    10

  • Issue of the periodical within the volume

    1

  • Country of publishing house

    GB - UNITED KINGDOM

  • Number of pages

    15

  • Pages from-to

    nestránkováno

  • UT code for WoS article

    001438597800001

  • EID of the result in the Scopus database

    2-s2.0-86000453245