Examination of Wet Assembling Methods in Printed Flexible Electronics

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43965456" target="_blank" >RIV/49777513:23220/22:43965456 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9812763" target="_blank" >https://ieeexplore.ieee.org/document/9812763</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812763" target="_blank" >10.1109/ISSE54558.2022.9812763</a>

Result language
angličtina
Original language name
Examination of Wet Assembling Methods in Printed Flexible Electronics
Original language description
This paper examines two methods of assembling electronics SMD components on flexible substrates with low-temperature resistance. As a contact medium for interconnection between component and conductive pattern, conductive adhesive MG Chemicals 8331S-15G or conductive Ag printing paste DuPont PE 874 was used. The contact resistance of samples was measured after the assembling process and then mechanical tests were performed. Samples were subjected to a bend test and a rapid change of temperature in the shock chamber. Tests have shown that Ag paste can withstand high mechanical and temperature stress due to its stretchability and can partly return to its previous state after mechanical stress is released. On the other hand, conductive adhesive, which is rigid, tends to fail under high mechanical and temperature stress. Ag paste shows great assumptions to be used in the field of flexible or even stretchable electronics as a contact medium.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2022 45th International Spring Seminar on Electronics Technology : /proceedings/
ISBN
978-1-66546-589-2
ISSN
2161-2536
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Piscaway
Event location
Vienna, Austria
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200013

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