Assembly method and its influence on electrically conductive adhesives and solder pastes joints durability
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F15%3A00300022" target="_blank" >RIV/68407700:21230/15:00300022 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=7248012&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel7%2F7229501%2F7247949%2F07248012.pdf%3Farnumber%3D7248012" target="_blank" >http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=7248012&url=http%3A%2F%2Fieeexplore.ieee.org%2Fiel7%2F7229501%2F7247949%2F07248012.pdf%3Farnumber%3D7248012</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7248012" target="_blank" >10.1109/ISSE.2015.7248012</a>
Alternative languages
Result language
angličtina
Original language name
Assembly method and its influence on electrically conductive adhesives and solder pastes joints durability
Original language description
This article is focused on comparing of different assembly methods, particularly stencil printing and dispensing paste deposition and compares lead and lead-free solder pastes with one-component and two-component epoxy based electrically conductive adhesives. The evaluation method is based on resistance measurement after accelerated stress tests. The aging was conducted using automatic mechanical cyclic stress machine tester and joint resistance to environment was tested using long term temperature straining and combined humidity and temperature straining. Shear strength measurement was done in order to determine mechanical stability of the connection.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
38th International Spring Seminar on Electronics Technology (ISSE 2015)
ISBN
978-1-4799-8860-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
310-314
Publisher name
Institute of Electrical and Electronics Engineers
Place of publication
New York
Event location
Eger
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000374113000063