Adhesive Bonds Mechanical Properties after the Degradation Process

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60460709%3A41310%2F13%3A67722" target="_blank" >RIV/60460709:41310/13:67722 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Adhesive Bonds Mechanical Properties after the Degradation Process
Original language description
Adhesive bonding technology is dynamically evolving method of the material bonding and that is the reason of its using in the huge range of the industries. In reference to growing evolution, the needs for continuous testing and limits determination of the adhesive bonds grow to keep bonded structures secure. Many producers mention the adhesive resistance to moisture or water in a product list. The research showed that adhesive resistance to liquid mediums is lower and ultimate strength decreases with the exposure time. Experimental data also show that mechanical properties of epoxy adhesives are gradually restored.
Czech name
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Czech description
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Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
6th International Scientific Conference on Rural Development - Innovations and Sustainability
ISBN
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ISSN
1822-3230
e-ISSN
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Number of pages
4
Pages from-to
51-54
Publisher name
ALEKSANDRAS STULGINSKIS UNIVERSITY, CENTRE RURAL SOCIAL RESEARCH, FAC ECONOMICS & MANAGEMENT, UNIVERSITETO STR 10-406, AKADEMIJA, KAUNAS DISTR 53361, LITHUANIA
Place of publication
Akademija, LITHUANIA
Event location
Kaunas, Akademija, LITHUANIA
Event date
Nov 28, 2013
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000357670300008

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