Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22310%2F16%3A43902855" target="_blank" >RIV/60461373:22310/16:43902855 - isvavai.cz</a>

Alternative codes found

RIV/00216305:26220/16:PU119693

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

Original language description

The article deals with creating solid joints of Low Temperature Co-fired Ceramic with Al2O3 (Alumina) or SiC chips. The aim of this study is to find material of standard thick film layer (TFL) process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 oC).

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JH - Ceramics, fire-proof materials and glass

OECD FORD branch

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Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2016

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Materials Structure &amp; Micromechanics of Fracture

ISBN

978-80-214-5357-9

ISSN

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e-ISSN

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Number of pages

5

Pages from-to

631-634

Publisher name

Vutium

Place of publication

Brno

Event location

Brno

Event date

Jun 27, 2016

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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