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Temperature Stabilized Chip Expander

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26230%2F15%3APU117008" target="_blank" >RIV/00216305:26230/15:PU117008 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.13140/RG.2.1.1154.4084" target="_blank" >http://dx.doi.org/10.13140/RG.2.1.1154.4084</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.13140/RG.2.1.1154.4084" target="_blank" >10.13140/RG.2.1.1154.4084</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Temperature Stabilized Chip Expander

  • Original language description

    For measurements and testing of experimental semiconductor structures there raises a problem with the connection between the chip and the measuring circuit. Our proposed chip expander provides the function of the carrier substrate (Al2O3) with CTE compatibility to experimental silicon chip. It also allows expansion of terminals chip into a larger area. Interconnection between the chip and the conductive topology realized on a carrier substrate is realized by wire bonding (gold wire or AlSi1 form with diameter 17.5 up to 75 microns). Test measurement system is connected either the standard soldered pins or through precision gold plated SIP socket pins. Very flat planar configuration of the chip expander allows you to work in very small chambers such as the AFM microscopes, etc. Another significant advantage of expander chip is also the possibility of its own temperature stabilization through the heating element located on the reverse side. This chip expander is thanks to its CTE and possibilities of flexible leads (gull-wing) can also be used as an adapter for mounting of large semiconductor chips into ordinary test boards (FR4). The article discusses the use of chip expanders in the context of polymorphic chips experiments. In this case chip expander with mounted polymorphic chip are thermally stabilized at a temperature range from ambient temperature to 120 ° C. Polymorphic circuits can be considered as multifunctional circuits that change of their behavior comes from modifications in the characteristic of components involved in the circuit in response to controls temperature.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20206 - Computer hardware and architecture

Result continuities

  • Project

    <a href="/en/project/LD14055" target="_blank" >LD14055: Unconventional Design Techniques for Intrinsic Reconfiguration of Digital Circuits: From Materials to Implementation</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2015

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition

  • ISBN

    978-0-9568086-1-5

  • ISSN

  • e-ISSN

  • Number of pages

    6

  • Pages from-to

    1-6

  • Publisher name

    IMAPS-Deutschland e.V.

  • Place of publication

    Friedrichshafen

  • Event location

    Friedrichshafen

  • Event date

    Sep 14, 2015

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000380428600016