PDMS microfluidic chips prepared by a novel casting and pre-polymerization method
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22340%2F10%3A00023213" target="_blank" >RIV/60461373:22340/10:00023213 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
PDMS microfluidic chips prepared by a novel casting and pre-polymerization method
Original language description
In this work, we have developed a novel and cheap fabrication method of microfluidic chips made of native PDMS. The method relies on traditional PDMS casting against a SU8 master, however, it essentially differs in (i) the use of phosphor bronze (PB) substrates instead of silicon wafers as ?carriers? for SU8 structures and (ii) accomplishing the irreversible sealing of two PDMS layers without oxygen plasma treatment. Specially pre-treated PB substrates possess a relatively high surface roughness, whichprovides mechanical stability of SU8 structures on PB substrates and significantly improves bonding strength between a PDMS cast and a PDMS mate. Microchannel sealing is based on bonding the PDMS casts to pre-polymerized PDMS layers. This developed method was successfully tested in the fabrication of microfluidic devices for various purposes, e.g. study of segmented flow, study of electroosmotic flow, or detection of bioaffinity complexes.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
CI - Industrial chemistry and chemical engineering
OECD FORD branch
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Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Microelectronic Engineering
ISSN
0167-9317
e-ISSN
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Volume of the periodical
87
Issue of the periodical within the volume
5-8
Country of publishing house
NL - THE KINGDOM OF THE NETHERLANDS
Number of pages
3
Pages from-to
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UT code for WoS article
000276300700235
EID of the result in the Scopus database
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