Lead-Free Solders Intended For Higher Temperatures
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27230%2F09%3A00020386" target="_blank" >RIV/61989100:27230/09:00020386 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Lead-Free Solders Intended For Higher Temperatures
Original language description
A design for a lead-free solder intended for higher application temperatures. Alternative solder production. Structural analysis, chemical microanalysis, and semi-quantitative chemical analysis of BiAg11 solder. BiAg11 solder wettability on copper, nickel and silver surfaces.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JR - Other machinery industry
OECD FORD branch
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Result continuities
Project
<a href="/en/project/LN00B029" target="_blank" >LN00B029: Centre of Materials and Technology Resaerch</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Sborník vědeckých prací VŠB - TU Ostrava, řada strojní
ISSN
1210-0471
e-ISSN
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Volume of the periodical
2009
Issue of the periodical within the volume
3
Country of publishing house
CZ - CZECH REPUBLIC
Number of pages
5
Pages from-to
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UT code for WoS article
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EID of the result in the Scopus database
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