Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F21%3A10248628" target="_blank" >RIV/61989100:27360/21:10248628 - isvavai.cz</a>

Result on the web

<a href="https://www.mdpi.com/2075-4701/11/4/624" target="_blank" >https://www.mdpi.com/2075-4701/11/4/624</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/met11040624" target="_blank" >10.3390/met11040624</a>

Result language

angličtina

Original language name

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Original language description

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 degrees C and full melting is completed at 405 degrees C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20500 - Materials engineering

Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2021

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Metals

ISSN

2075-4701

e-ISSN

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Volume of the periodical

11

Issue of the periodical within the volume

4

Country of publishing house

CH - SWITZERLAND

Number of pages

21

Pages from-to

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UT code for WoS article

000643281000001

EID of the result in the Scopus database

2-s2.0-85104028326