Influence of Microstructure Instability on Creep Behaviour of UFG Pure Materials

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F12%3A00385915" target="_blank" >RIV/68081723:_____/12:00385915 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Influence of Microstructure Instability on Creep Behaviour of UFG Pure Materials
Original language description
Experiments were conducted to determine an effect of creep temperature on creep behaviour of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373-573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). The microstructure analyses showed that microstructure of pure Cu processed by 8 ECAP passes and subsequent creep exposure contained large fraction of boundaries with coincidence sites lattice(CSL). The results showed that creep in UFG materials is influenced by additional creep mechanisms up to 0.5 Tm when the UFG microstructure in more or less stable.
Czech name
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Czech description
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Project
<a href="/en/project/GPP108%2F10%2FP469" target="_blank" >GPP108/10/P469: Influence of initial crystallographic orientation on creep behaviour of SPD materials</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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