Influence of Grain Size on Creep Behavior of Copper Processed by ECAP

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F12%3A00386294" target="_blank" >RIV/68081723:_____/12:00386294 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Influence of Grain Size on Creep Behavior of Copper Processed by ECAP
Original language description
Experiments were conducted to determine an effect of ECAP pressing on the creep behavior of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373, 473 and 573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. The results demonstrate that the n of coarse-grained material increases from the value n 6 measured at 573K to the value of n 14 determined at 373 K. However, the values of stress exponent n of UFG material were about 6 at 373, 473 and 573 K over relatively wide range of strain rates. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). It was found that the change of grain size and number of high-angle grain boundaries in the microstructure influence the transition fro
Czech name
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Czech description
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Project
<a href="/en/project/GPP108%2F10%2FP469" target="_blank" >GPP108/10/P469: Influence of initial crystallographic orientation on creep behaviour of SPD materials</a><br>
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Creep and Fracture of Engineering Materials and Structure
ISBN
978-4-88903-407-3
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
460-464
Publisher name
The Japan Institute of Metals
Place of publication
Sendai
Event location
Kyoto
Event date
May 27, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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