Microstructure changes in HPT-processed copper occurring at room temperature
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F19%3A00506561" target="_blank" >RIV/68081723:_____/19:00506561 - isvavai.cz</a>
Alternative codes found
RIV/00216208:11320/19:10401222
Result on the web
<a href="https://doi.org/10.1016/j.matdes.2019.107582" target="_blank" >https://doi.org/10.1016/j.matdes.2019.107582</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.matchar.2019.03.046" target="_blank" >10.1016/j.matchar.2019.03.046</a>
Alternative languages
Result language
angličtina
Original language name
Microstructure changes in HPT-processed copper occurring at room temperature
Original language description
In the present work, the long-term stability of ultrafine-grained (UFG) copper at room temperature was investigated. The pure copper specimen was processed by 10 revolutions of high-pressure torsion (HPT) at room temperature. This procedure imposes an equivalent strain of about 300 to the material sample. In the region of these large strains, a saturation in grain size refinement occurs. UFG copper, deformed up to the region of microstructure saturation, was subsequently annealed at room temperature for 6 years. Microstructure changes of HPT-processed copper were investigated by means of 2D and 3D electron back scatter diffraction (EBSD) and also by transmission electron microscopy. nIt was found that the UFG microstructure of copper with saturated HPT-grain sizes coarsens significantly during long-term storage at room temperature. The analysis of grain volumes showed that the boundaries of coarse grains often contain flat segments with the coincidence site lattices (CSL) Σ3 and Σ9. The misorientation distributions revealed that most boundaries in the annealed microstructure are low energy grain boundaries of these kinds. However, groups of fine grains that are surrounded by random boundaries can also be found in the microstructure. Furthermore, 3D EBSD data were analysed in order to obtain a statistical microstructural information. The microstructure contains a high number of fine grains, but they form only a minority of the investigated volume. Quantitative geometrical characteristics of grain boundaries including CSL were described and interpreted.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20501 - Materials engineering
Result continuities
Project
<a href="/en/project/GC17-00393J" target="_blank" >GC17-00393J: Parametric representation and stochastic 3D modeling of grain microstructures in polycrystalline materials using random marked tessellations</a><br>
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Materials Characterization
ISSN
1044-5803
e-ISSN
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Volume of the periodical
151
Issue of the periodical within the volume
MAY
Country of publishing house
US - UNITED STATES
Number of pages
10
Pages from-to
602-611
UT code for WoS article
000467668600063
EID of the result in the Scopus database
2-s2.0-85063762165