? Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F10%3A00178862" target="_blank" >RIV/68407700:21110/10:00178862 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

? Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures

Original language description

The development of a new technology for the fabrication of Micro-Electro-Mechanical-System (MEMS) strain sensors to realize a novel type of crackmeter for health monitoring of ageing civil infrastructures is reported. The fabrication of micromachined silicon MEMS sensors based on a Silicon On Insulator (SOI) technology, designed according to a Double Ended Tuning Fork (DETF) geometry is presented, using a novel process to fabricate sensors with low motional resistance. The techniques suited for bondingthe MEMS sensors on a steel surface and a packaging technique for the bonded sensors are proposed for ageing infrastructure monitoring. Moreover, the design of a possible crackmeter geometry suited for detection of crack contraction and expansion with aresolution of 10 ?m and very low power consumption requirements is presented. In these sensors, the small crackmeter range for the first field use is related to long-term observation on existing cracks in the tunnel test sections.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JM - Structural engineering

OECD FORD branch

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Project

<a href="/en/project/GA103%2F06%2F1257" target="_blank" >GA103/06/1257: Research of Ageing of Underground Infrastructures with the help of Micromeasurements and Monitoring Systems</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2010

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Smart Structures and Systems

ISSN

1738-1584

e-ISSN

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Volume of the periodical

2010 (6)

Issue of the periodical within the volume

3

Country of publishing house

KR - KOREA, REPUBLIC OF

Number of pages

14

Pages from-to

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UT code for WoS article

000276936700005

EID of the result in the Scopus database

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