Universal heat exchanger for air and evaporative cooling of electronics

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F21%3A00350084" target="_blank" >RIV/68407700:21220/21:00350084 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1016/j.tsep.2021.100865" target="_blank" >https://doi.org/10.1016/j.tsep.2021.100865</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.tsep.2021.100865" target="_blank" >10.1016/j.tsep.2021.100865</a>

Result language
angličtina
Original language name
Universal heat exchanger for air and evaporative cooling of electronics
Original language description
We present a heat exchanger design that was developed for low temperature cooling of medium power density electronics and, more specifically, for the particle detectors of the “forward” AFP and TOTEM experiments at the CERN Large Hadron Collider (LHC). The heat exchanger uses a metal foam to enhance internal heat transfe. Several prototypes have been built and tested, both in the laboratory and in direct application in the AFP experiment at the LHC. The temperature difference between the inlet air and the surface of the heat exchanger is 20 °C with a 20 W heat load, this difference drops to 10 °C when R-218 refrigerant is used instead of the air.
Czech name
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Czech description
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Type
J<sub>SC</sub> - Article in a specialist periodical, which is included in the SCOPUS database
CEP classification
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OECD FORD branch
20303 - Thermodynamics

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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