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Influence of Mechanical Stress on Change of Electrical Resistance of Electronic Components Connection

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F07%3A00132497" target="_blank" >RIV/68407700:21230/07:00132497 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of Mechanical Stress on Change of Electrical Resistance of Electronic Components Connection

  • Original language description

    The article compare changes of the electrical resistance mechanically stressed soldered joints lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2007

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Applied Electronics 2007

  • ISBN

    978-80-7043-537-3

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    45-48

  • Publisher name

    Západočeská univerzita v Plzni

  • Place of publication

    Plzeň

  • Event location

    Pilsen

  • Event date

    Sep 5, 2007

  • Type of event by nationality

    EUR - Evropská akce

  • UT code for WoS article