Influence of Mechanical Stress on Change of Electrical Resistance of Electronic Components Connection
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F07%3A00132497" target="_blank" >RIV/68407700:21230/07:00132497 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence of Mechanical Stress on Change of Electrical Resistance of Electronic Components Connection
Original language description
The article compare changes of the electrical resistance mechanically stressed soldered joints lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2007
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Applied Electronics 2007
ISBN
978-80-7043-537-3
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
45-48
Publisher name
Západočeská univerzita v Plzni
Place of publication
Plzeň
Event location
Pilsen
Event date
Sep 5, 2007
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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