Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F07%3A00167842" target="_blank" >RIV/68407700:21230/07:00167842 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
Original language description
Nanoparticle addition into commonly used ECAs improves resistance to mechanical straining but lowers resistance to moisture.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2007
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
30th International Spring Seminar on Electronics Technology 2007
ISBN
978-1-4244-1217-4
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
IEEE
Place of publication
New York
Event location
Cluj-Napoca
Event date
May 9, 2007
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000255232500002