Study of Modification of Conductive Adhesive by Nanoparticles and Aging of Modified Adhesive

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338503" target="_blank" >RIV/68407700:21230/19:00338503 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990752" target="_blank" >http://dx.doi.org/10.1109/SIITME47687.2019.8990752</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/SIITME47687.2019.8990752" target="_blank" >10.1109/SIITME47687.2019.8990752</a>

Result language
angličtina
Original language name
Study of Modification of Conductive Adhesive by Nanoparticles and Aging of Modified Adhesive
Original language description
Modification of electrically conductive adhesive by adding silver nanoparticles in low concentration with the goal to improve mechanical/electrical properties was carried out. The goal of the work was to find how concentration and quality of mixing the nanoparticles into the adhesive influence the resistance of adhesive joints. Then modified adhesives were aged at the high temperature (125 oC, 45 % RH) and the high relative humidity (98 % RH, 24 oC). It was found that mixing and moisture have a significantly greater effect on increasing the joint resistance than the temperature.
Czech name
—
Czech description
—

Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)
ISBN
978-1-7281-3330-0
ISSN
2641-287X
e-ISSN
—
Number of pages
4
Pages from-to
118-121
Publisher name
Politehnica
Place of publication
Bucharest
Event location
Cluj-Napoca
Event date
Oct 23, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000564733700024

Similar results(10)